Standards Updates For Non-Members

This high-level update is based on the results of that meeting and intended for the general non-member public. VITA Members can obtain members-only detailed status on each working group after logging into their account.

Contact VITA if you are interested in participating in any of these working groups. Visit Events for details on upcoming VITA meetings. If your company is not attending, you are missing an excellent opportunity to network, contribute and influence the future of VITA standards. 

The September 2023 VITA Standards Organization (VSO) meeting was held in San Diego and was hosted by Cubic. Several working groups have current projects underway; the following roundup summarizes those projects:

Draft/VITA 46.0-2019 Revision: VPX Baseline Standard

Abstract: This standard describes VITA 46.0 VPX Baseline Standard; an evolutionary step forward for the provision of high-speed interconnects in harsh environment applications. This revision supports compliance requirements of higher-level Open System Standards, adds guide socket/pin rotations for additional power supply configurations and provides further clarifications to power wafer current ratings.

Status: The working group made updates for compliance requirements and support for 12 V power. The public ballot has been completed and waiting for final ANSI approval.

VITA 46.31-2020-VDSTU: Higher Data Rate VPX, Solder Tail

Abstract: This document defines a standard for a VPX connector that supports higher data rates, to at least 25 Gbaud – for protocols such as 100GBASE KR4 Ethernet and PCIe Gen 4. The connectors feature a short solder tail intended to be soldered into a blind via. The higher data rate connectors compliant to VITA 46.31 are intermateable to legacy VITA 46.0 connectors and follow the same form factor.

Status: VITA 46.31 is approved for VITA Standard Draft Trial Use available to VITA members and is available at the VITA online store. The plan is to complete the ANSI process and release once further connector qualification testing is completed.

Draft/VITA 47.1-2023x: Common Requirements for Environments, Design and Construction, Safety, and Quality Standard

Abstract: The VITA 47 group of standards defines environmental, design and construction, safety, and quality requirements for commercial-off-the-shelf (COTS) Plug-In Modules intended for ground and aerospace applications. VITA 47.1 addresses requirements common across the VITA 47 group of standards. This revision updates the operating and non-operating temperature requirements, adds cold wall requirements for VITA 48.2 conduction cooled Plug-In Modules, and adds additional temperature cycling & cold start requirements.

Status: Multiple additions and changes are being made to improve usability of this standard. Revision draft is in review.

Draft/VITA 48.5-R2010 (S202x) Revision: Mechanical Standard for VPX REDI AFT Cooling – Multi Pitch Air Flow Through Cooling, 1.52" Pitch

Abstract: This standard establishes the design requirements for an air-flow-through (AFT) cooled plug-in unit. Unlike ANSI/VITA 48.1, which uses cooling air impinged directly upon the components and circuit boards, this plug-in unit uses a compact core heat exchanger located within the central heat sink of the unit and uses a mil /aero qualified seal on the inlet and outlet of the heat exchanger eliminating any direct air contact with the PWB and components. This seal also provides ability for chassis level flow balancing allowing plug in units with different cooling requirements in the same chassis. This standard defines both a 3U and 6U form factor, in various pitches and air inlet sizes providing a high-performance thermal solution for existing or new CCA designs.

Status: This standard is open for revisions to more clearly define some of the rules and recommendations. Verification method notation being added.

Draft/VITA 48.7-2014 Revision: Mechanical Standard for VPX REDI Air Flow-By™ Cooling

Abstract: This standard defines a detailed mechanical implementation for Air Flow-By cooling and sealing technologies applied to plug-in modules, backplanes, and sub-racks as defined in VITA 46/48. Air Flow-By cooling seals, environmentally and EMI, the PCBA within heat exchanging covers, convectively cooling the assembly without exposing the PCBA to the cooling air.

Status: This working group has completed making revisions to the standard and is preparing for public consensus ballot.

Draft/VITA 48.9: VPX AFT Cooling - Retractable Seals

Abstract: This standard defines an airflow through module format, 3U and 6U, that uses retractable module rack seals to improve module – chassis seal durability, simplifies the design by eliminating tapered module and chassis features, and allow easy migration of existing CCA designs to an air cooled module format.

Status: Working group is developing a draft document.

Draft/VITA 51.4-202xx: Reliability Component Stress Analysis and Derating Standard

Abstract: This document describes an open standard for parts stress analysis and derating. It establishes uniform methods to increase a component's reliability margin by decreasing the amount of applied stress (i.e., voltage, current, temperature, power, etc.) to an electronic, electrical, or electromechanical part. Reducing the stress levels improves device reliability/durability by reducing failure rates, thereby improving the reliability and availability of the product.

Status:This working group has joined forces with the IEEE to jointly develop this standard under IEEE-2818. A draft document has been completed. The working group is preparing for public consensus ballot through IEEE.

Draft/VITA 65.0-2023 Revision: OpenVPX System Standard

Abstract: The OpenVPX System Standard was created to bring versatile system architectural solutions to the VPX market. Based on the extremely flexible VPX family of standards, the OpenVPX standard uses Plug-In Module mechanical, connectors, thermal, communications protocols, utility, and power definitions provided by specific VITA standards to define a series of Slot, Backplane, Module, and Standard Development Chassis Profiles.

Status: ANSI/VITA 65.0-2023 was published in June of 2023. Now open for new profile proposals.

Draft/VITA 65.1-2023 Revision: OpenVPX System Standard – Profile Tables

Abstract: This standard documents variations of Slot, Backplane, and Modules Profiles. As part of the Slot Profile Description, there are also some Connector Modules defined. This document is primarily tables which are referenced by VITA 65.0. (PDF and Excel versions available)

Status: See VITA 65.0 status.

Draft/VITA 67.3-2020 Revision: Coaxial Interconnect on VPX, Spring-Loaded Contact on Backplane

Abstract: This document describes an open standard for configuration and interconnect within the structure of VITA 67.0 enabling an interface compatible with VITA 46 containing multi-position blind mate analog connectors with coaxial contacts, having fixed contacts on the Plug-In Module and spring action on the backplane.

Status: The working group has completed revisions to the standard and is preparing for public consensus ballot.

Draft/VITA 68.0-2017 + Errata Revision: VPX Compliance Channel Standard

Abstract: VITA 68.0 is the Base Standard of the VITA 68.x family of standards for signal integrity compliance of VPX systems and components. This standard provides an overview of the VITA 68.x family of standards and defines common requirements for VPX modules and VPX backplanes that apply across the range of VITA 68.x standards.

Status: Open for revisions to make terminology consistent with other current standards.

Draft/VITA 68.1-2017 + Errata Revision: VPX Compliance Channel - Fixed Signal Integrity Budget Standard

Abstract: This standard defines a VPX compliance channel fixed signal Integrity budget including module performance criteria and common backplane performance criteria required to support multiple fabric types across a range of defined baud rates. This allows backplane developers to design a VITA 68.1 compliant backplane that supports required bit error rates (BER) for multiple fabric types when used with modules that are compliant to VITA 68.1 budget criteria. This also allows module developers to design VITA 68.1 compliant Plug-In Modules that are interoperable with other VITA 68.1 compliant modules when used with a VITA 68.1 compliant backplane. VITA 68.1 defines a single budget encompassing modules and backplanes at various baud rates, with a “large system budget” that supports interoperability of VITA 68.1 compliant modules with any VITA 68.1 compliant backplane, including large slot count backplanes with relatively long traces.

Status: Open for revisions to make terminology consistent with other current standards.

Draft VITA 68.3: Reference Model Standard for Gen4 and Higher Speeds

Abstract: This standard documents a reference model approach for OpenVPX Signal Integrity compliance at baud rates above 10.3125 Gbaud. It defines reference OpenVPX Plug-In Module and backplane s-parameter models that can be used to create end-end OpenVPX reference channels in conjunction with reference VPX connector and device s-parameter models. Signal Integrity compliance for an OpenVPX Plug-In Module or backplane is based on simulation of end-end channel compliance against the requirements of the applicable protocol standard.

Status: This VITA working group is addressing signal integrity compliance for Gen4 and higher speeds for VPX. The initial draft has been completed.

Draft/VITA 78.0-2022 Revision: SpaceVPX System Standard

Abstract: This document describes an open standard for creating high performance fault tolerant interoperable backplanes and modules to assemble electronic systems for spacecraft and other high availability applications. Such systems support a wide variety of use cases across the aerospace community. This standard leverages the OpenVPX standards family and the commercial infrastructure that supports these standards. This next revision of the VITA 78.0 Standard updates the System Management section with respect to new content in VITA 46.11, adds new content on single string systems in addition to its current discussion on dual redundant, fully-fault tolerant, systems, additional communication protocols (such as PCIe), the addition of more specific mechanical and thermal content to provide guidance for flight systems, and, finally, the addition of more specific content on power architectures.

Status: The standard is open for revisions to the 2022 edition.

Draft/VITA 78.2: SpaceVPX System Standard – Profile Tables

Abstract: This standard documents variations of Slot, Backplane, and Modules Profiles. This document is primarily tables which are referenced by VITA 78.0.

Status: The working group has developed a draft document of the standard that is currently on hold by the working group.

VITA 85.106: VPX Expanded

Abstract: The goal of this study group is to define a solution to expand VPX to - Double the density of current VPX connectors - Connector length stays the same - Support 100G x 4 @ 400 G-baud - P0 Connector will need to be looked at for Power Capacity (500+ Watts)

Status: VITA study group evaluating evolutionary performance options for next generation high performance computing. Working on parallell with VITA 85.104 study group.

VITA 85.107: VPX Power Supply Application Guide

Abstract: The goal for this study group is to develop a tutorial/guide for users of VITA 62.x and VITA 86 based on the presentation "NAII VITA VPX Power Supply Connector Guide" presented at the May 2022 VSO meeting in Newark, DE.

Status: This study group is developing a tutorial/guide for users of VITA 62.x and VITA 86 based on the presentation "NAII VITA VPX Power Supply Connector Guide".

VITA 85.108: Power Distribution and Control

Abstract: Active industry initiatives for Modular Open System Architectures (MOSA) are requiring Open Architecture (OA) system and component level solutions that enable interoperability. This naturally extends to boxes that provide power distribution and controls including electronic circuit breaker (ECB) functionality. While VITA 62 specifies management of power for use by other modules internal to a given box power distribution and controls uniquely deals with box-to-box management of power. As a result, the VITA 85.108 Study Group will assess the application of 3U and 6U VPX form-factors along with associated module and backplane connectorization to facilitate standardization of modular power distribution and controls functions including ECBs.

Status: VITA study group to assess the application of 3U and 6U VPX form-factors along with associated module and backplane connectorization to facilitate standardization of modular power distribution and controls functions including electronic circuit breakers. Plan to become working group once report has been delivered, reviewed, and sponsors identified.

Draft/VITA 87-202x: MT Circular Connectors - Type 1

Abstract: This document defines a standard for circular connectors with optical MT. Circular connector shells are compliant to MIL-STD-38999. MT offer options for 12 or 24 fibers per MT and for physical contact or lensed MT.

Status: The working group has approved a draft document and started the public consensus ballot.

Draft/VITA 89-202x: MT Circular Connectors - Type 2

Abstract: Defines a standard for circular connectors with optical MT. Circular connector shells are compliant to MIL-STD-38999. MT offer options for up to 48 fibers per MT and for physical contact or lensed MT.

Status: VITA working group to develop a new standard for circular connectors with optical MT. Working group is developing draft document.

Draft/VITA 90.0-202xx: VNX+ Base Standard

Abstract: This document is the base standard for an Enhanced Small Form Factor System that meets the growing needs of improved Size, Weight and Power (SWaP) with a rugged, low cost, fast serial fabric interconnect based Plug-In Module. The VITA 90.x family of standards builds on the foundation established by VITA 74 VNX. VNX+ significantly increases performance and system versatility beyond VITA 74, while following its mechanical framework.

Status: Working group formed to make revisions to VNX under VNX+. Draft document nearing completion.

Draft/VITA 90.1-202xx: VNX+ Profile Tables/h2>

Abstract: This standard documents variations of Slot, Backplane, and Modules Profiles. This document is primarily tables which are referenced by VITA 90.0.

Status: Working group formed to make revisions to VNX under VNX+.

Draft/VITA 90.2-202xx: VNX+ Optical and Coax Apertures - Type 1

Abstract: This standard defines the configuration of Optical and RF/Video Coaxial signals used for blind mating of Optical and RF/Video contacts in VNX+ systems.

Status: Working group formed to make revisions to VNX under VNX+. Draft document near completion.

Draft/VITA 90.3-202xx: VNX+ Power Supply and Storage Modules

Abstract: This standard defines the requirements to implement VNX+ compatible Power Conversion and Energy Storage Plug-In Modules in VNX+ systems.

Status: Working group formed to make revisions to VNX under VNX+. Draft document near completion.

Draft/VITA 90.4-202xx: VNX+ Cooling and Mounting Systems

Abstract: This standard defines alternate retention and thermal management system features in VNX+ systems. These features include wedge locks, heat pipes, mounting hardware, retention mechanisms, and chassis interfaces.

Status: Working group formed to make revisions to VNX under VNX+.

Draft/VITA 90.5-202xx: Space VNX+

Abstract: This standard defines a scalable, portable, resilient, and modular VNX+ Architecture used in small spacecraft.

Status: Working group formed to make revisions to VNX under VNX+ for development of a potential standard for space platforms.

Draft/VITA 90.7-202xx: VNX+ Optical and Coax Apertures - Type 2

Abstract: This standard defines the configuration of Optical and RF/Video Coaxial signals used for blind mating of Optical and RF/Video contacts in VNX+ systems.

Status: Working group formed to define NanoRF coax/optical connector modules for VNX+.

Draft/VITA 91.0-202x: Connector for Higher Density VITA 46 Applications

Abstract: This standard defines a connector system that provides higher pin density to the backplane for VPX applications.

Status: VITA working group to develop a new standard for higher pin density for VPX. Working group is balloting draft document.

Draft/VITA 91.1-202x: System Standard for Higher Density VITA 46 Applications

Abstract: This standard defines a system definition that provides higher pin density to the backplane for VPX applications.

Status: VITA working group to develop a new standard for higher pin density for VPX.

Draft/VITA 92.0: High Performance Cable – Ruggedized 10 Gbaud Bulkhead High Speed, D-Sub, Rectangular Connector for Copper Cables

Abstract: This standard defines a rugged standardized 10 Gbaud interconnect system with a high pin count and high-density, light weight, rectangular connector (meets MIL-DTL-24308 physical envelope) for I/O. It can support multiple high bandwidth protocols and power while optimizing SWaP benefits in smaller systems with limited panel space availability.

Status: Working group is developing draft document.

Draft/VITA 93.0: QMC - Small Form Factor Mezzanine

Abstract: This standard, referred to as QMC, defines a Small Form Factor mezzanine that is significantly smaller than XMC with both a host and I/O interface connectors. The host interface supports modern high- speed serial fabrics. Multiple modules can be installed on various carrier card form factors including 3U/6U Eurocards (VPX, cPCI, VME, etc.), VNX+, PCIe expansion cards, and others. It is suitable for deployment in commercial, industrial, space, or military-grade rugged environments with air-cooled or conduction-cooled formats.

Status: Working group is developing draft document.