The March 2021 VITA standards meeting was a virtual only meeting via WebEx. This update is based on the results of that meeting.
Contact VITA if you are interested in participating in any of these working groups. Visit Events for details on upcoming VITA meetings. If your company is not attending, you are missing an excellent opportunity to network, contribute and influence the future of VITA standards. We meet every two months and would love see more participation at our meetings and working groups.
Several working groups have current projects underway; the following roundup summarizes those projects:
Objective: The VITA 42.0 XMC standard defines a popular mezzanine card architecture using a PCIe interconnect to host carrier modules.
Status: The standard is due for its five-year review. The working group is reviewing revisions to bring the standard in line with current practice in related standards. A Signal Integrity (SI) appendix is being developed to include with the next release of the standard.
Objective: The VITA 46.0 base standard defines physical features that enable high-speed communication in a compliant system.
Status: The standard is open for revisions. The working group is reviewing updates for verification methodology and compliance and requirements for 12V power.
Objective: The VITA 46.11 standard defines a system management architecture for VPX systems.
Status: The standard is due for its five-year review. Improvements based on feedback from the community are under consideration.
Objective: The VITA 46.31 standard defines a standard for a VPX connector that supports higher data rates, to at least 25 Gbaud, for protocols such as 100GBASE-KR4 Ethernet and PCIe Gen 4. The connectors feature a short solder tail intended to be soldered into a blind via. The higher data rate connectors compliant to VITA 46.31 are intermateable with legacy VITA 46.0 connectors and follow the same form factor.
Status: VITA 46.31 is approved for VITA Standard Draft Trial Use available to VITA members and is available at the VITA online store. The plan is to complete the ANSI process and release once further connector qualification testing is completed.
Objective: The VITA 48 standards provide an overview of the associated plug-in units for air-cooling, conduction cooling, and liquid flow thru and spray cooling applications. Specific connector-mounting details are defined in VITA 46. The VITA 48 family of standards defines applicable detailed dimensions of key module and sub-rack interfaces. The implementations described in these standards are targeted for 3U and 6U form factor boards on 0.85 and 1.00 centers. However, the packaging approach presented is applicable to boards with other form factors, different connector series and can accommodate alternate module pitches.
Status: The standards are being updated to allow for a 100mm deep VPX module. The working group is developing a draft of the updates.
Objective: This standard establishes the mechanical design requirements for a LFT cooled electronic VPX module.
Status: This working group is making revisions to the standard.
Objective: The goal of this study group is to develop a new component derating standard.
Status: This working group has joined forces with the IEEE to jointly develop this standard under IEEE-2818. A draft document has been developed. The working groups encourages industry participation and inputs for determining the appropriate derating considerations, specifically what derating levels your company typically uses. This would help the working group find consensus derating levels for components that are useful for the industry.
Objective: The VITA 57 FMC standards define an IO mezzanine module. This mezzanine module is in a smaller form factor, when compared to PMC/XMC modules and assumes that it will be connected to a FPGA device or other device with reconfigurable IO capability. This standard describes FMC IO modules and introduces an electro-mechanical standard that creates a low overhead bridge. This is between the front panel IO, on the mezzanine module, and an FPGA processing device on the carrier card, which accepts the mezzanine module.
Status: The working group is reviewing diagrams to make updates to the image quality. The updates are planned to be released as errata to the existing standards.
Objective: The VITA 61 XMC 2.0 standard, based upon VITA 42.0 XMC, defines an open standard for supporting high-speed, switched interconnect protocols on an existing, widely deployed form factor, but utilizing an alternate, ruggedized, high-speed mezzanine interconnector.
Status: The standard is due for its five-year review. Comments on revisions to match VITA 42 and VITA 88 changes are now in review.
Objective: The VITA 62.0 standard describes requirements for building a power supply module that can be used to power a VPX chassis. The modules fit within the standard envelope defined for VPX modules in the VITA 48.0 standards.
Status: The standard is being revised to be in line with additions made to the VPX standards.
Objective: The VITA 62.1 standard describes requirements for building a high-voltage/3-phase/3U class front-end power supply module that can be used to power a VPX chassis in the VITA 62 family of standards. The module will fit within the standard envelope defined for VPX modules in the VITA 48.0 standards.
Status: The working group is developing a draft document that is in review.
Objective: The OpenVPX architectural framework standard is a living document that is regularly updated with new profile information and corrections.
Status: The ANSI/VITA 65.0-2019 and ANSI/VITA 65.1-2019 standards were ratified by ANSI and VITA. The standard is available for download by VITA members and is posted at the VITA Store for purchase by non-members. New profiles based on work with Sensors Open Systems Architecture (SOSA) are being developed.
Objective: This document describes an open standard for configuration and interconnect within the structure of VITA 66.0 enabling an interface compatible with VITA 46 containing blind mate optical connectors with fixed contacts on the Plug-In Module and floating displacement on the backplane.
Status: The working group is developing the draft document.
Objective: The VITA 67.3 standard defines an open standard for configuration and interconnect within the structure of VITA 67.0, enabling an interface compatible with VITA 46 containing multi-position blind-mate analog connectors with SMPM-style contacts having fixed contacts on the plug-in module and spring action on the backplane.
Status: The standard is open for revision. The document has completed public ANSI/VITA review and is in the comment resolution phase.
Objective: This standard defines a VPX compliance channel, including common backplane performance criteria required to support multiple fabric types across a range of defined baud rates. This standard allows backplane developers to design a back-plane that supports required bit error rates (BER) for multiple fabric types. This also allows module developers to design plug-in modules that are interoperable with other modules when used with a compliant backplane.
Status: The document has completed public ANSI/VITA review and ballot.
Objective: The VITA 74.x documents define a mechanical format for standardization of switched serial interconnects for small form-factor applications.
Status: The study group is gathering inputs for development of a potential standard for space platforms.
Objective: VITA 78 is an open standard for creating high-performance, fault-tolerant interoperable backplanes and modules to assemble electronic systems for spacecraft and other high-reliability (availability) applications. Such systems will support a wide variety of use cases across the aerospace community, including some non-spacecraft systems. This standard leverages the VPX standards family and the commercial infrastructure that supports these standards in non-space applications.
Status: The standard is open for revisions. The documents have completed public ANSI/VITA review and are in the comment resolution phase.
Objective: This standard leverages the work done on ANSI/VITA 78 to create a standard with an emphasis on 3U module implementations. The most significant change from SpaceVPX is to shift the distribution of utility signals from the utility-management module to the system-controller module to allow a radial distribution of supply power to up to eight payload modules.
Status: The working group has developed a draft document of the standard that is currently in working group ballot.
Objective: The VITA 87 MT circular connector standard defines a standard for circular connectors with optical MT. Circular connector shells are compliant to MIL-STD-38999. MT offer options for 12 or 24 fibers per MT and for physical contact or lensed MT.
Status: The working group is reviewing a draft document.
Objective: The VITA 88 XMC+ standard defines an improved electrical/mechanical mezzanine connector for XMC applications. Mechanically, the proposed connector is compatible with VITA 42/61 footprints, achieving backward compatibility while offering improved mating/unmating forces. Electrically, speeds up to PCIe Gen 5 (32 Gbps) and maximum SI performance are supported.
Status: The working group is developing a draft document.