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Standards Updates

The September 2022 VITA Standards Organization (VSO) meeting was in San Diego and was hosted by Cubic. This update is based on the results of that meeting.

Contact VITA if you are interested in participating in any of these working groups. Visit Events for details on upcoming VITA meetings. If your company is not attending, you are missing an excellent opportunity to network, contribute and influence the future of VITA standards.

Several working groups have current projects underway; the following roundup summarizes those projects:

Draft/VITA 46.0-2019 Revision: VPX Baseline Standard

Abstract: This standard describes VITA 46.0 VPX Baseline Standard; an evolutionary step forward for the provision of high-speed interconnects in harsh environment applications. This revision supports compliance requirements of higher-level Open System Standards, adds guide socket/pin rotations for additional power supply configurations and provides further clarifications to power wafer current ratings.

Status: The standard is open for revisions. The working group is reviewing updates for compliance requirements and support for 12 V power.

VITA 46.31-2020-VDSTU: Higher Data Rate VPX, Solder Tail

Abstract: This document defines a standard for a VPX connector that supports higher data rates, to at least 25 Gbaud – for protocols such as 100GBASE KR4 Ethernet and PCIe Gen 4. The connectors feature a short solder tail intended to be soldered into a blind via. The higher data rate connectors compliant to VITA 46.31 are intermateable to legacy VITA 46.0 connectors and follow the same form factor.

Status: VITA 46.31 is approved for VITA Standard Draft Trial Use available to VITA members and is available at the VITA online store. The plan is to complete the ANSI process and release once further connector qualification testing is completed.

Draft/VITA 48.0-2020 Revision: Mechanical Specification for Microcomputers using Ruggedized Enhanced Design Implementation (REDI)

Abstract: This standard defines a mechanical implementation for Plug-In Modules. Two types of Plug-In Modules are defined: Type 1 and Type 2. Both Type 1 and Type 2 Plug-In Modules take advantage of increased slot pitch to provide enhanced thermal performance and increased structural durability. Type 1 units support Two Level Maintenance while Type 2 units do not. This revision adds a 100 mm length and a 1.2-inch pitch.

Status: The standard is being updated to allow for a 100mm deep VPX module. The working group has submitted the proposed standard for public consensus ballot approval.

Draft/VITA 48.2-2020 Revision: Mechanical Specification for Microcomputers using Ruggedized Enhanced Design Implementation (REDI)

Abstract: This standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two Level Maintenance compatibility. This revision adds a 100 mm length and a 1.2-inch pitch.

Status: The standard is being updated to allow for a 100mm deep VPX module. The working group has submitted the proposed draft standard for public consensus ballot approval.

Draft/VITA 48.4-2018 Revision: Liquid Flow Through VPX Plug-In Module Standard

Abstract: This standard establishes the mechanical design interface control, outline and mounting requirements for a liquid-flow-through cooled Plug-In Module to ensure the mechanical intermateability of 6U VPX liquid-flow-through cooled Plug-In Module within associated sub-racks. The connector layout remains common with VITA 46. This Plug-In Module uses liquid flowing through an integral heatsink of the module for cooling the electronic components and circuit boards. The quick disconnect coupling assemblies allow fluidic coupling to the chassis coolant manifold.

Status: This working group is making revisions to the standard.

Draft/VITA 48.7-2014 Revision: Mechanical Standard for VPX REDI Air Flow-By™ Cooling

Abstract: This standard defines a detailed mechanical implementation for Air Flow-By cooling and sealing technologies applied to plug-in modules, backplanes, and sub-racks as defined in VITA 46/48. Air Flow-By cooling seals, environmentally and EMI, the PCBA within heat exchanging covers, convectively cooling the assembly without exposing the PCBA to the cooling air. This revision …

Status: This working group is making revisions to the standard.

Draft/VITA 48.8-2017 Revision: Mechanical Standard for VPX REDI Air Flow Through Cooling, 1.0" to 1.5" Pitches

Abstract: This document describes an open standard for the design requirements for an air-flow-through cooled plug-in module having 3U and 6U form factors while retaining the VITA 46.0 connector layout. Unlike using cooling air impinged directly upon the components and circuit boards, this plug-in module uses a finned heat exchanger frame located within the central section of the assembly to top cool primary circuit board components as well as mezzanine board components. Both 3U and 6U standard form factors are offered using 3 defined pitch spacings, with options to have alternate air flow intake and exhaust paths. The plug-in modules of this standard exhibit a weight reduction and cost savings by eliminating both wedge retainer usage and module lever usage by way of using light weight jack screws for plug-in module insertion and extraction into a subrack chassis. The intention of this standard is to optimize SWAP-C (Size, Weight, Power, Cost).

Status: This working group is making revisions to the standard with focus on updating backplane tab dimensions, thickness, jackscrew and guide pins.

Draft/VITA 51.4: Reliability Component Derating Standard

Abstract: This document describes an open standard for parts stress analysis and derating. It establishes uniform methods to increase a component's reliability margin by decreasing the amount of applied stress (i.e., voltage, current, temperature, power, etc.) to an electronic, electrical, or electromechanical part. Reducing the stress levels improves device reliability/durability by reducing failure rates, thereby improving the reliability and availability of the product.

Status: This working group has joined forces with the IEEE to jointly develop this standard under IEEE-2818. A draft document has been developed.

This working group encourages industry participation and inputs for determining the appropriate derating considerations, specifically what derating levels your company typically uses. This would help the working group find consensus derating levels for components that are useful for the industry.

Draft/VITA 62.0-2016 Revision: Modular Power Supply Standard

Abstract: This standard provides requirements for building a power supply module that can be used to power a VPX chassis. The module will fit within the standard envelope defined for VPX modules in the VITA 48.0 standards.

Status: The standard is due for its five-year review. The working group has submitted the proposed draft standard for public consensus ballot approval.

Draft/VITA 62.1: Three Phase High-Voltage Power Supply Front-End in a 3U Plug-In Module Standard

Abstract: This standard provides requirements for a Three Phase High-Voltage Power Supply Front-End in a 3U Plug-In Module that can be used to power a VPX chassis in the VITA 62 family of standards. The Plug-In Module will fit within the standard envelope defined for VPX Plug-In Modules in the VITA 48.0 standards.

Status: The working group is developing a draft document that is in review.

Draft/VITA 65.0-2021 Revision: OpenVPX System Standard

Abstract: The OpenVPX System Standard was created to bring versatile system architectural solutions to the VPX market. Based on the extremely flexible VPX family of standards, the OpenVPX standard uses Plug-In Module mechanical, connectors, thermal, communications protocols, utility, and power definitions provided by specific VITA standards to define a series of Slot, Backplane, Module, and Standard Development Chassis Profiles. This revision adds additional profiles, additional communication protocols, higher speed copper connectors, and a new naming methodology for Module Profiles.

Status: The working group is adding additional profiles to this standard.

Draft/VITA 65.1-2021 Revision: OpenVPX System Standard – Profile Tables

Abstract: This standard documents variations of Slot, Backplane, and Modules Profiles. As part of the Slot Profile Description, there are also some Connector Modules defined. This document is primarily tables which are referenced by VITA 65.0. (PDF and Excel versions available)

Status: The working group is adding additional profiles to this standard.

Draft VITA 66.5: Optical Interconnect On VPX - Hybrid Variant

Abstract: This document describes an open standard for configuration and interconnect within the structure of VITA 66.0 enabling an interface compatible with VITA 46 containing blind mate optical connectors with fixed contacts on the Plug-In Module and floating displacement on the backplane.

Status: The working group is developing a draft proposed standard.

Draft/VITA 67.3-2020 Revision: Coaxial Interconnect on VPX, Spring-Loaded Contact on Backplane

Abstract: This document describes an open standard for configuration and interconnect within the structure of VITA 67.0 enabling an interface compatible with VITA 46 containing multi-position blind mate analog connectors with coaxial contacts, having fixed contacts on the Plug-In Module and spring action on the backplane.

Status: The working group is developing revisions to the standard.

Draft VITA 68.3: Reference Model Standard for Gen4 and Higher Speeds

Abstract: This standard documents a reference model approach for OpenVPX Signal Integrity compliance at baud rates above 10.3125 Gbaud. It defines reference OpenVPX Plug-In Module and backplane s-parameter models that can be used to create end-end OpenVPX reference channels in conjunction with reference VPX connector and device s-parameter models. Signal Integrity compliance for an OpenVPX Plug-In Module or backplane is based on simulation of end-end channel compliance against the requirements of the applicable protocol standard.

Status: VITA Study Group Addressing Signal Integrity Compliance for Gen4 and Higher Speeds.

Draft/VITA 74.0-2017 Revision: Compliant System Small Form Factor Module (VNX) Base Standard

Abstract: This standard meets the growing needs for improved Size, Weight and Power (SWaP) with a rugged, low cost, fast serial fabric interconnect based Plug-In Module, whilst leveraging many proven features of existing VITA standards. This revision documents the migration from VITA 74 VNX to VITA 90 VNX+ family of standards, adds revised voltage levels for specific signals, as well as corrected connector part numbers and drawings.

Status: The working group is developing a draft of revisions.

Draft/VITA 78-2015 Revision: SpaceVPX System

Abstract: This document describes an open standard for creating high performance fault tolerant interoperable backplanes and modules to assemble electronic systems for spacecraft and other high availability applications. Such systems will support a wide variety of use cases across the aerospace community. This standard leverages the OpenVPX standards family and the commercial infrastructure that supports these standards.

Status: The standard is open for revisions. The documents have completed public ANSI/VITA review and are in the comment-resolution phase.

Draft/VITA 78.1: SpaceVPX Lite

Abstract: The proposed dot standard of the SpaceVPX Systems Specification defines a lightweight implementation with significant advantages in Size, Weight, Power and Cost (SWaP-C) for 3U module systems. It is "lightweight" with respect to the reduced scope of requirements compared to the SpaceVPX base standard that results in a smaller SWaP-C footprint for deployment.

Status: The working group has developed a draft document of the standard that is currently in working group ballot.

Draft/VITA 78.2: SpaceVPX System Standard – Profile Tables

Abstract: This standard documents variations of Slot, Backplane, and Modules Profiles. This document is primarily tables which are referenced by VITA 78.0.

Status: The working group has developed a draft document of the standard that is currently in working group ballot.

VITA 85.104 Study Group: Common Plug-In Module Form Factor SG

Abstract: Study group to assess the feasibility of a multi-use form factor without compromising the thermal solution.

Status: This study group is evaluating evolutionary options for next generation high performance computing.

VITA 85.105 Study Group: Impedance Matched box-to-box Connectors Study Group

Abstract: Active industry initiatives for Modular Open System Architectures (MOSA) are requiring Open Architecture (OA) system and component level solutions that enable interoperability. This extends to high performance box-to-box connectivity supporting common COTS protocols as enabling technology for platform network backbones, peripheral networks, etc. The protocols are evolving quickly and there is immediate need for ruggedized, open architecture connectivity solutions.

The VITA 85.105 Study Group will assess box-to-box, impedance matched, open architecture connectivity needs to assure high integrity data paths. The 5 top level tasks will include 1) developing a SOW focusing primarily on connectors that will include 2) market survey of existing solutions, 3) a user survey of what is needed to support protocols and mechanical requirements, 4) executing the user survey and finally 5) publish findings and recommendations.

Status: VITA Study Group to assess box-to-box, impedance matched, open architecture connectivity needs to assure high integrity data paths.

Draft/VITA 87: MT Circular Connector

Abstract: This document defines a standard for circular connectors with optical MT. Circular connector shells are compliant to MIL-STD-38999. MT offer options for 12 or 24 fibers per MT and for physical contact or lensed MT.

Status: The working group is reviewing a draft document.

Draft/VITA 90.0: VNX+ Base Standard

Abstract: This document is the base standard for an Enhanced Small Form Factor System that meets the growing needs of improved Size, Weight and Power (SWaP) with a rugged, low cost, fast serial fabric interconnect based Plug-In Module. The VITA 90.x family of standards builds on the foundation established by VITA 74 VNX. VNX+ significantly increases performance and system versatility beyond VITA 74, while following its mechanical framework.