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TEWS Technologies Launches VNX+ Carrier Board for QMC Modules as VITA 90 Standard Achieves Ratification
Full press release
The TVNX210 is designed to serve as a carrier board within the VNX+ form factor, providing two independent single-width QMC sites that can be populated with up to two single-width QMC modules or a double-width QMC module. The QMC carrier is offering system integrators a flexible, modular path to deploying QMC-based processing and I/O on rugged platforms. Target application areas include aerospace and defense where compliance with open standards reduces integration risk and extends platform longevity.
The QMC sites are connected via a non-blocking PCIe Gen 3 switch that distributes the VNX+ backplane’s x8 PCIe link from the expansion plane or the two x4 PCIe links from the data planes. The full QMC I/O of the two QMC sites is accessible on the VNX+ backplane via the 400-pin High Speed Data Connector (HSDC), conforming to the Dual QMC Carrier slot profile of the VITA 90 standard (VNX.PL-1-02.400-7.2.1.3). A Management Controller implemented according to VITA 46.11 allows QMC health status monitoring and communication with the VNX+ System Management.
View the full specification of TVNX210
The VITA 90 VNX+ Small Form Factor Chassis, 726 Series from Atrenne, is a compact, rugged computing platform designed for SWaP-constrained military and aerospace applications. Built on OpenVPX standards, it supports a Modular Open Systems Approach (MOSA) that simplifies integration, upgrades, and technology refresh.
The VITA 90 VNX+ Small Form Factor Chassis architecture supports a range of Intel and NVIDIA processors and offers flexible I/O options to match mission-specific requirements. Its small form factor makes it ideal for deployment in unmanned vehicles, missiles, aircraft pods, and other space-limited environments where reliable operation in harsh conditions is critical.
For engineers who need to align with current open standards, the platform is fully compatible with the latest VITA 90 VNX+ Small Form Factor Chassis specifications and is designed to plug into broader VPX/OpenVPX system architectures. The 726 Series is currently available in 3-slot and 6-slot configurations, giving program teams a scalable path from lab development to deployed systems.
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This board serves as a precision‑engineered interposer and mechanical adapter between a VNX+ 19 mm, 400‑pin SBCIO PIM (Plug‑In Module) and a SOSA‑aligned OpenVPX Payload Slot conforming to profile MOD3‑PAY‑1F1F2U1TU1T1U1T‑16.2.15‑1.
Designed to simplify system integration, the adapter enables seamless insertion of a VNX+ module into a compatible VPX backplane slot without requiring any redesign of the host system. It preserves full signal mapping between the VNX+ PIM connector and the corresponding VPX interfaces defined by the SOSA Technical Standard.
This is a fully passive interposer, containing no active components, power regulation, or signal conditioning. Its purpose is purely mechanical and electrical adaptation, ensuring:
This adapter is ideal for developers and system integrators who need to evaluate, prototype, or deploy VNX+ processing modules within existing VPX‑based architectures, particularly in defense, aerospace, and high‑reliability embedded systems.
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Avalanche Technology, the leader in MRAM technology is introducing the next-generation VNX+ storage module. Designed specifically for military and Low Earth Orbit (LEO) environments, this innovative solution delivers unparalleled radiation immunity, survivability in congested electromagnetic environments, and highest-reliability performance using Avalanche’s true Space Grade MRAM.
Built with Avalanche’s high-density Space Grade MRAM and running on a Lattice CertusPro™-NX FPGA known for its radiation tolerance and industry-leading low SER (Soft Error Rate), the module achieves true radiation immunity without the traditional trade-offs in density, speed, or endurance. This breakthrough disrupts conventional industry approaches while leveraging standard form factors and interfaces, allowing partners to seamlessly integrate sub systems from multiple suppliers.
While many technologies claim to be “Space Grade,” true Space Grade requires that 5 objective criteria be met simultaneously. Space Grade technology must:
In space systems, a technology that survives radiation but loses data, wears out over time, delays data commitment, or lacks flight heritage is not Space Grade. Partial compliance leads to failure. Avalanche Space Grade MRAM uniquely delivers on all 5 criteria, through radiation immunity, permanent data retention, unlimited endurance, deterministic nanosecond writes, and proven flight qualification, without tradeoffs or compromise.
Today’s announcement focuses on these two criteria: Survive and Retain. The Avalanche Technology VNX+ Storage platform is engineered to survive in the harshest space environments with radiation immunity by design, leveraging field-proven Space Grade MRAM that provides tolerance to radiation effects. This includes immunity to Single Event Effects (SEE) and disruptions up to 100 krad minimum ensuring mission-critical data remains uncorrupted and the VNX+ device remains fully operational even during demanding LEO and Military Operations.
Next-generation small form factor standard designed to support reliable, modular embedded systems across defense, aerospace and industrial applications.
Trident Infosol, a trusted provider of rugged embedded systems, proudly announces the launch of Falcon 3R, the latest innovation in its proven Falcon family of small form factor (SFF) computers. Designed for the most demanding avionics, defense, aerospace, and rugged industrial applications, Falcon 3R delivers a breakthrough combination of enhanced capabilities, expanded I/O flexibility, and unmatched SWaP (Size, Weight, and Power) efficiency.
Powered by the 13th Gen Intel® Core™ i7-13800HRE processor (6 performance cores + 8 efficiency cores, 20 threads), Falcon 3R not only builds on the legacy of the Falcon line but takes a decisive leap forward with significantly expanded mezzanine card support—5 x MiniPCIe and 2 x XMC slots—making it the most I/O-intensive system in the Falcon family. This advancement allows engineers to deploy a far wider range of I/O modules, ideal for complex mission-critical and data-heavy applications.
“Falcon 3R represents a major leap forward in rugged computing, bringing best-in-class performance in the industry’s most compact footprint,” said Mr. Pawan Seth, Director at Trident Infosol. “With its enhanced mezzanine card architecture, it unlocks a new level of I/O scalability, giving our customers the flexibility they need for evolving defense and aerospace requirements.”
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