VNX+ Products

This board serves as a precision‑engineered interposer and mechanical adapter between a VNX+ 19 mm, 400‑pin SBCIO PIM (Plug‑In Module) and a SOSA‑aligned OpenVPX Payload Slot conforming to profile MOD3‑PAY‑1F1F2U1TU1T1U1T‑16.2.15‑1.

Designed to simplify system integration, the adapter enables seamless insertion of a VNX+ module into a compatible VPX backplane slot without requiring any redesign of the host system. It preserves full signal mapping between the VNX+ PIM connector and the corresponding VPX interfaces defined by the SOSA Technical Standard.

This is a fully passive interposer, containing no active components, power regulation, or signal conditioning. Its purpose is purely mechanical and electrical adaptation, ensuring:

• Correct connector alignment and form‑factor translation
• Direct pass‑through of signals between VNX+ and VPX interfaces
• Mechanical stability for ruggedized or embedded deployments
• Compliance with SOSA and VNX+ mechanical envelope requirements

This adapter is ideal for developers and system integrators who need to evaluate, prototype, or deploy VNX+ processing modules within existing VPX‑based architectures, particularly in defense, aerospace, and high‑reliability embedded systems.

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Avalanche Technology, the leader in MRAM technology is introducing the next-generation VNX+ storage module. Designed specifically for military and Low Earth Orbit (LEO) environments, this innovative solution delivers unparalleled radiation immunity, survivability in congested electromagnetic environments, and highest-reliability performance using Avalanche’s true Space Grade MRAM.

Built with Avalanche’s high-density Space Grade MRAM and running on a Lattice CertusPro™-NX FPGA known for its radiation tolerance and industry-leading low SER (Soft Error Rate), the module achieves true radiation immunity without the traditional trade-offs in density, speed, or endurance. This breakthrough disrupts conventional industry approaches while leveraging standard form factors and interfaces, allowing partners to seamlessly integrate sub systems from multiple suppliers.

While many technologies claim to be “Space Grade,” true Space Grade requires that 5 objective criteria be met simultaneously. Space Grade technology must:

1. survive radiation without disruption

2. retain data for the life of a mission

3. endure unlimited writes

4. commit data instantly

5. prove real space heritage

In space systems, a technology that survives radiation but loses data, wears out over time, delays data commitment, or lacks flight heritage is not Space Grade. Partial compliance leads to failure. Avalanche Space Grade MRAM uniquely delivers on all 5 criteria, through radiation immunity, permanent data retention, unlimited endurance, deterministic nanosecond writes, and proven flight qualification, without tradeoffs or compromise.

Today’s announcement focuses on these two criteria: Survive and Retain. The Avalanche Technology VNX+ Storage platform is engineered to survive in the harshest space environments with radiation immunity by design, leveraging field-proven Space Grade MRAM that provides tolerance to radiation effects. This includes immunity to Single Event Effects (SEE) and disruptions up to 100 krad minimum ensuring mission-critical data remains uncorrupted and the VNX+ device remains fully operational even during demanding LEO and Military Operations.

Development Platform for WOLF VNX Plus Modules

• Platform for testing WOLF VNX Plus modules
• Compatible with WOLF VNXP-ORIN-NX and VNXP-FGX2-VIO
• Designed to fit in a standard Micro ATX frame
• Numerous inputs and outputs
• Datasheet – View/Download

VNX+ with 4K Video Capture/Transmit, up to Four SDI In/Out

• VNX+ extremely small form factor rugged module
• WOLF Frame Grabber eXtreme 2 (FGX2)
• Up to two 12G-SDI or up to four 6G/3G/HD-SDI SerDes inputs and outputs
• Module power: 12 to 25W (depending on options)
• Datasheet – View/Download

VNX+ with NVIDIA Jetson Orin NX, SBC and Processing Node

• Orin NX 16GB with embedded Ampere GPU: 1024 CUDA cores, 32 Tensor cores
• Embedded 8-core NVIDIA Cortex ARM64 CPU, 2GHz
• 1TB NVMe SED (Self Encrypting Drive)
• Module power: configurable from 20W – 35W
• Datasheet – View/Download

Next-generation small form factor standard designed to support reliable, modular embedded systems across defense, aerospace and industrial applications. 

Learn more . . .

Trident Infosol, a trusted provider of rugged embedded systems, proudly announces the launch of Falcon 3R, the latest innovation in its proven Falcon family of small form factor (SFF) computers. Designed for the most demanding avionics, defense, aerospace, and rugged industrial applications, Falcon 3R delivers a breakthrough combination of enhanced capabilities, expanded I/O flexibility, and unmatched SWaP (Size, Weight, and Power) efficiency.

Powered by the 13th Gen Intel® Core™ i7-13800HRE processor (6 performance cores + 8 efficiency cores, 20 threads), Falcon 3R not only builds on the legacy of the Falcon line but takes a decisive leap forward with significantly expanded mezzanine card support—5 x MiniPCIe and 2 x XMC slots—making it the most I/O-intensive system in the Falcon family. This advancement allows engineers to deploy a far wider range of I/O modules, ideal for complex mission-critical and data-heavy applications.

“Falcon 3R represents a major leap forward in rugged computing, bringing best-in-class performance in the industry’s most compact footprint,” said Mr. Pawan Seth, Director at Trident Infosol. “With its enhanced mezzanine card architecture, it unlocks a new level of I/O scalability, giving our customers the flexibility they need for evolving defense and aerospace requirements.” 

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