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QMC Collateral

  • Wednesday, July 29, 2026 2:43 PM | Jerry Gipper (Administrator)

    By: Tim Tews, General Manager, TEWS Technologies GmbH

    New standards like VITA 90 (VNX+) and VITA 93 (QMC) are important steps in bringing MOSA principles to even the smallest and most limited edge platforms without making trade-offs. Together, these standards create multi-layer modular systems that support scalable, flexible, and future-ready designs for many defense applications.

    Visit Military&Aerospace Electronics for the full article.

  • Wednesday, May 20, 2026 2:47 PM | Jerry Gipper (Administrator)

    By: Jesse Silano, DDC

    Modern aerospace and defense platforms require higher processing capability, greater I/O density, and improved signal integrity while simultaneously shrinking in size and operating within tighter thermal envelopes. As mission systems evolve to support advanced sensors, AI workloads, and distributed architectures, designers are increasingly constrained by SWaP demands and the limitations of legacy mezzanine standards. Against this backdrop, the recent introduction of the VITA 93 QMC specification presents new opportunities for embedded system designers and rugged integration labs that require high-speed, high-density I/O within harsh environments. QMC enables a significantly smaller mezzanine footprint compared to PMC, XMC, or VPX while preserving the rugged mechanical and environmental characteristics.

    Download PDF of whitepaper.

  • Wednesday, September 03, 2025 2:51 PM | Jerry Gipper (Administrator)

    By: Tim Tews, General Manager, TEWS Technologies GmbH

    The defense landscape is evolving rapidly – nowhere more visibly than in the skies over Ukraine. There, small, cost-effective drones have become indispensable tools for surveillance, targeting, and tactical disruption. This shift underscores a broader reality: embedded systems must now be smaller, more modular, and rapidly adaptable to new mission requirements. Platforms must be smaller, more modular, and rapidly upgradable. One powerful response to these demands is the emergence of the VITA 93 QMC standard that brings unprecedented modularity, flexibility, scalability, and ruggedness to system designers, making it highly relevant to modern defense and aerospace applications.

    Read the full article in Military Embedded Systems.

  • Thursday, July 24, 2025 2:55 PM | Jerry Gipper (Administrator)

    By: William Wong, Senior Content Director, Electronic Design

    The kickoff for VITA’s new VITA 93 QMC standard occurred at this year’s Embedded Tech Trends conference. Mark Littlefield, Director of Systems Products at Elma Electronic, gave a short introduction to the standards .

    Read the full article and watch video at Electronic Design.

  • Tuesday, July 22, 2025 3:02 PM | Jerry Gipper (Administrator)

    By: William Wong, Senior Content Director, Electronic Design

    VITA’s new mezzanine card standard, VITA 93 QMC, targets any rugged or industrial application, not just its usual military and avionic applications. It utilizes Samtec’s AcceleRate HD Ultra-Dense, Slim Body Arrays with a 0.635-mm pitch. This connector is rated up to 64-Gb/s PAM4, making it ideal for high-speed serial interfaces like PCI Express Gen 6.

    Jan Zimmermann, General Manager at TEWS Technologies, gave a short overview at this year’s Embedded Tech Trends conference.

    Read the full article and watch video at Electronic Design.

  • Friday, April 11, 2025 5:23 PM | Jerry Gipper (Administrator)

    Set for ratification this year, QMC (VITA 93) is VITA’s next-generation small form factor Mezzanine (SFFm) standard that focuses on system expansion, while supporting existing embedded computing form factors. 

    Designed to seamlessly integrate with current open standards, like VPX, SOSA, and VNX+, QMC addresses modern high-speed data processing needs through modularity and flexible I/O. We asked some VITA community members:

    See the full article at the VITA Observation Deck.

  • Monday, February 17, 2025 5:13 PM | Jerry Gipper (Administrator)

    By: William Wong, Senior Content Director, Electronic Design

    Targeting most rugged applications, the SWaP-C-optimized VITA 93 QMC mezzanine standard defines a more compact and higher-speed alternative to other mezzanine standards.

    Read the full article at Electronic Design.

  • Friday, January 24, 2025 5:17 PM | Jerry Gipper (Administrator)

    By: Caroline Hayes, Electronics Weekly

    The VITA 93 standard is based on the QMC architecture for scalable, modular embedded systems.

    It has been introduced to address the high-speed data processing requirements, combined with size, weight and power (SWaP) constraints of today’s mil-aero applications.

    Previewing the mezzanine card standard at Embedded Tech Trends, Elma Electronics’ director of system products, Mark Littlefield (pictured), explained that VITA 93 is the same concept as the XMC standard but smaller and designed for rugged deployed applications. These include industrial, medical  and scientific research, energy, manufacturing and transportation as well as AI/ML in aerospace and defence.

    See the full article at Electronics Weekly.

  • Tuesday, January 14, 2025 5:06 PM | Jerry Gipper (Administrator)

    By: John Keller, Editor, Military&Aerospace Electronics

    The VITA 93 QMC standard, soon to be released, will be for small-form-factor embedded computing architectures such as VNX and VITA 90 VNX+, which are credit card-sized computer boards, as well as for the emerging VITA 100 standard, expected sometime next year, which will involve 3U, 6U, and perhaps other form factors, and is expected to replace and augment OpenVPX embedded computing.

    Visit Military&Aerospace Electronics for the full article.

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